MOLDING MATERIAL AND SUBSTRATE

PURPOSE:To obtain a molding material suitable for production of a substrate capable of realizing the reduction of number of parts and the automation of assembling operation in the assembling process of a precision equipment requiring dimensional accuracy and dimensional stability. CONSTITUTION:A mol...

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Bibliographische Detailangaben
1. Verfasser:	TASHIRO TOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a molding material suitable for production of a substrate capable of realizing the reduction of number of parts and the automation of assembling operation in the assembling process of a precision equipment requiring dimensional accuracy and dimensional stability. CONSTITUTION:A molding material obtained by blending a polyoxymethylene resin molding material with 1-10% powdery filler (e.g. talc) consisting of a substance having 1-3 Mohs hardness, having 0-0.15mm warp deformation amount in 120mm planar sheet, 20-60% tensile elongation, 30000-40000kg/cm flexural modulus and low wearability, and hardly causing stick slip against polyoxymethylene resin containing no filler.