SEMICONDUCTOR MANUFACTURING DEVICE

PURPOSE:To materialize the improvement of a manufactured semiconductor device, concerning a batch processing type of semiconductor manufacturing device. CONSTITUTION:A wafer holding jig 25 for holding a wafer 9 is provided fixedly inside a vertical reactor 21, and also a material gas chamber 31, to...

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Bibliographische Detailangaben
1. Verfasser:	HIGASHIMOTO MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING KILNS LIGHTING MECHANICAL ENGINEERING OPEN SINTERING OR LIKE APPARATUS OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PURPOSE:To materialize the improvement of a manufactured semiconductor device, concerning a batch processing type of semiconductor manufacturing device. CONSTITUTION:A wafer holding jig 25 for holding a wafer 9 is provided fixedly inside a vertical reactor 21, and also a material gas chamber 31, to which material gas is supplied once, is provided, and a section, through which material gas is supplied to the wafer, is constituted to rotate and shift by rotating a disc 33 where a material gas supply port 32 is made.