INTEGRATED CIRCUIT

PURPOSE:To reduce crosstalk noise due to input/output signals carried by bump electrodes by providing a conductive member to surround individual bump electrodes on the surface of a chip, and maintain the conductive member at a constant potential. CONSTITUTION:A conductive member 7 is provided between a chip 2 and a printed-circuit board 1, and individual solder bumps 6 on the chip surface are surrounded with a gap by the conductive member 7. The conductive member is connected to an external constant potential source through internal wiring 4, and it shields the individual bumps. The gap between the conductive member and each bump is maintained at vacuum with a low dielectric constant. As a result, it is possible to reduce crosstalk noise due to input/output signals carried by the solder bumps 6. Therefore, the transfer characteristics of input/ output signals are improved, thereby preventing the malfunction of a logic IC on the chip 2.