CREAM SOLDER

PURPOSE:To provide a cream solder which is used for packaging of printed boards and has high quality by coating the surface of solder particles with gold films, thereby preventing the surface oxidation of the solder particles and improving the wettability of the solder. CONSTITUTION:The cream solder...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA YUKIO, UMIBE SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To provide a cream solder which is used for packaging of printed boards and has high quality by coating the surface of solder particles with gold films, thereby preventing the surface oxidation of the solder particles and improving the wettability of the solder. CONSTITUTION:The cream solder is formed by providing the gold films 5 by electroless plating on the surfaces of the solder particles 4 and mixing a flux 6, a binder and a solvent 7 therewith.