FORMATION OF CIRCUIT FOR POLYMER CIRCUIT BOARD BY REMOVAL OF CHROME BONDED LAYER WITH DC ELECTRICITY

PURPOSE: To manufacture a microelectronic package having a copper circuit on a dielectric substrate by bringing a chromium adhesive layer, while sustaining in positive state, into contact with an aqueous sulfuric acid electrolyte thereby removing the chromium adhesive layer material from the dielect...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	UOORUTAA POORU PAUROUSUKII, JIYON JIYOZEFU GURENINGU, KENISU JIYOOJI SAKORAFUOSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: To manufacture a microelectronic package having a copper circuit on a dielectric substrate by bringing a chromium adhesive layer, while sustaining in positive state, into contact with an aqueous sulfuric acid electrolyte thereby removing the chromium adhesive layer material from the dielectric substrate. CONSTITUTION: A chromium adhesive layer is bonded onto a dielectric substrate and a copper species layer is bonded onto the chromium adhesive layer. The chromium adhesive layer is held electrolytically in series with a counter electrode. While sustaining the chromium adhesive layer positive with respect to the counter electrode, the chromium adhesive layer is brought into contact with an aqueous sulfuric acid electrolyte and the chromium adhesive layer material is removed from the dielectric substrate thus manufacturing a microelectronic package 1 having a copper surface circuit. The circuit package 1 comprises a surface circuit 31 in the form of a pair of polymer layers 21 having a through hole 41 and at least one integrated circuit chip 51.