MULTILAYER FILM CAPACITOR AND MANUFACTURE THEREOF

PURPOSE:To enable the miniaturization, the weight reduction, the cost reduction of a capacitor, and the improvement of solderability by making a copper film in an inert gas atmosphere at a specific pressure by a plasma flame coating method. CONSTITUTION:A film laminate A is constituted of the lamina...

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Bibliographische Detailangaben
Hauptverfasser: KONDO TOSHIFUMI, HAGA MIKIO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To enable the miniaturization, the weight reduction, the cost reduction of a capacitor, and the improvement of solderability by making a copper film in an inert gas atmosphere at a specific pressure by a plasma flame coating method. CONSTITUTION:A film laminate A is constituted of the lamination part of an inner electrode layer 2 and a dielectric layer 3, excepting the extensions at the ends of the inner electrode layer 2. A protective film 4 is made to cover the surface of this film laminate A and the peripheral insulating board 1 extensively. Furthermore, an external electrode 5 is made at both ends of the insulating board 1, including the ends of the extensions of both inner electrode layers 2 not covered with this protective film 4, by flame-coating copper in an inert gas atmosphere of 20-300Torr in pressure by plasma flame-coating method. Hereby, the material cost reduction and the reduction of manhours become possible.