METHOD FOR BONDING TILE

PURPOSE:To fill a joint filler to tile joints in a several minutes without requiring a curing time from coating to curing by bonding tiles to cement-based boards by using a reactive urethane-based hot melt adhesive. CONSTITUTION:In bonding tiles to cement-based boards, a reactive urethane- based hot...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMORI MASARU, YOSHIMOTO YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DYES LIME, MAGNESIA METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES REFRACTORIES SLAG TREATMENT OF NATURAL STONE USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To fill a joint filler to tile joints in a several minutes without requiring a curing time from coating to curing by bonding tiles to cement-based boards by using a reactive urethane-based hot melt adhesive. CONSTITUTION:In bonding tiles to cement-based boards, a reactive urethane- based hot melt adhesive is used. For example, a reactive urethane-based hot melt adhesive comprising a polyurethane prepolymer (especially preferably polyurethane prepolymer obtained by reacting a mixed polyol of a liquid or low-softening polyester polyol and a highly crystalline thermoplastic polyester polyol as a polyol composition with a polyisocyanate compound in an equivalent ratio of NCO/OH of >=2) can be used as the hot melt adhesive.