SEMICONDUCTOR PACKAGE

PURPOSE:To improve high frequency characteristics while reducing stray capacity regardless of the size of a chip to be incorporated in a die pad part. CONSTITUTION:A die pad part 1a is divided by an insulated stripe 1b. The small chips are incorporated on one die pad part 1a, and large chips are inc...

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Bibliographische Detailangaben
1. Verfasser:	OGATA TOSHIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES
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Beschreibung
Zusammenfassung:	PURPOSE:To improve high frequency characteristics while reducing stray capacity regardless of the size of a chip to be incorporated in a die pad part. CONSTITUTION:A die pad part 1a is divided by an insulated stripe 1b. The small chips are incorporated on one die pad part 1a, and large chips are incorporated using a plurality of die pad part 1a to make the area of the die pad part 1a minimum capable of incorporating the chip. The stray capacity of the package is held according to a chip 5 to be incorporated.