SEMICONDUCTOR DEVICE

PURPOSE:To reduce a thermal resistance due to thin film bonding and to increase an yield of assembly for a semiconductor device. CONSTITUTION:A package 5 and a semiconductor element 1 which is attached to the attachment surface 8 of the package 5 are formed nearly in the same size. This device is so...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	NAGAYOSHI SHINSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE:To reduce a thermal resistance due to thin film bonding and to increase an yield of assembly for a semiconductor device. CONSTITUTION:A package 5 and a semiconductor element 1 which is attached to the attachment surface 8 of the package 5 are formed nearly in the same size. This device is so structured that the package may be die-bonded (40) onto the semiconductor element 1 with a thin film adhesive 20.