BONDING METHOD

PURPOSE:To extremely enhance bonding strength without using an adhesive by a method wherein a hardly adhesive resin is brought into contact with a metal under pressure while melted to be held to the metal and subsequently cooled and solidified to form a bonded body of the resin and the metal. CONSTI...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIURA TAKESHI, MINATO KIKUO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To extremely enhance bonding strength without using an adhesive by a method wherein a hardly adhesive resin is brought into contact with a metal under pressure while melted to be held to the metal and subsequently cooled and solidified to form a bonded body of the resin and the metal. CONSTITUTION:In a bonding apparatus, a pair of rods 2 are erected on a stand 1 and an upper frame 3 is fixed to the upper parts of the respective rods 2 through nuts 4. A cylinder 12 having a heater 11 provided on the outer periphery thereof is provided between pistons 5, 10 and the end parts 5a, 10a of the pistons 5, 10 are inserted in the hole 12a of the cylinder 12 and upper and lower adherends 13, 14 composed of a metal are internally provided in the hole 12a. In a concrete bonding method, the adherends 13, 14 being round rods made of brass are prepared and bonded using a polytetrafluoroethylene resin 15. That is, the resin 15 is inserted in the gap between the upper and lower adherends 13, 14 to be heated under pressure and subsequently cooled to form a bonded body 20.