MULTILAYER CERAMIC SUBSTRATE

PURPOSE:To substantially equalize the volumetric shrinkage rates of a layer conductor in a via hole and a multilayer ceramic substrate after baking without increasing the electric resistance. CONSTITUTION:A paste composed of mixture of at least two types of metal powder having different grain size i...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUNISHI RYUICHI, AKASAKI HIDEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To substantially equalize the volumetric shrinkage rates of a layer conductor in a via hole and a multilayer ceramic substrate after baking without increasing the electric resistance. CONSTITUTION:A paste composed of mixture of at least two types of metal powder having different grain size is employed in order to equalize the volumetric shrinkage rates of a baked green sheet and a layer conductor in a via hole made in a ceramic board composed of baked green sheet.