METHOD FOR MOLDING RESIN

PURPOSE:To provide a method for the molding of resin, which makes it possible to form a uniform IMC layer by eliminating difficulties in forming the IMC layer, as desired, on the surfaces of primary molded articles due to an IMC material filled in a porosity generated at the joining part of SMCs in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUJI KAZUHISA, SHINOMORI MASATOSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide a method for the molding of resin, which makes it possible to form a uniform IMC layer by eliminating difficulties in forming the IMC layer, as desired, on the surfaces of primary molded articles due to an IMC material filled in a porosity generated at the joining part of SMCs in the case where the SMC is dividedly set at the article molding part of a bottom force, which consists of two article parts, and pressurized to mold the primary molded articles by a high-pressure IMC process. CONSTITUTION:An SMC sheet 9 is placed so as to partly cover the surfaces of both of SMCs 8 and fill a space therebetween, thereby molding primary molded articles. Alternatively, a material through which an IMC material is unable to permeate is applied to the portion of a top force, which corresponds to a portion where a joining part is to be formed, to mold primary molded articles. Or, air in a porosity is replaced with the IMC material by preliminarily injecting the IMC material prior to the injection of the IMC material.