MANUFACTURE OF COMPOSITE CERAMIC MULTILAYER WIRING BOARD

PURPOSE:To enable a ceramic multilayer wiring board enhanced in high density wiring and protected against interlaminar separation, fissures, warpage, and the like to be manufactured at a low cost. CONSTITUTION:An insulating layer 3 is formed on a conductor layer 2 of a ceramic multilayer board 1 thr...

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Bibliographische Detailangaben
Hauptverfasser:	OKISHIMA TETSUYA, YAMANAKA HISAYOSHI, ASAKAWA TORU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To enable a ceramic multilayer wiring board enhanced in high density wiring and protected against interlaminar separation, fissures, warpage, and the like to be manufactured at a low cost. CONSTITUTION:An insulating layer 3 is formed on a conductor layer 2 of a ceramic multilayer board 1 through a partial printing method, then a die bonding land 4 is provided onto the upside of the insulating layer 3 concerned through a printing method, a part of the die bonding land 4 is connected to a ground line or a power supply line located lower, and the board 1 is burned simultaneously.