JPH0428135B

PURPOSE:To avoid any defective bonding process due to misoperation of a contact detector 12 by a method wherein the bonding process is performed using a slide block under elastic load of an energizing means. CONSTITUTION:A controller 2 controls the lifting and lowering operations of a slide block 1 conforming to various data stored in a memory 2b. The block 1 is rapidly lowered from the top dead center H to the position immediately before contact M to be slowly lowered from the position immediately before contact M to the bottom dead center L at specified distant DELTAH low speed. During the lowering operation, a capillary 5 in contact with the bonding surface performs the first bonding process I making use of the elastic load of a spring 6a due to clockwise rotation of a bonding arm 3 caused by the lowering action of the slide block 1. The slide block 1 is lifted rapidly to reach the top dead center H in the second bonding process II. While the slide block 1 is stopped at the top dead center H, an XY table is shifted to locate and electrode 8b at the position immediately below the capillary 5. Likewise the slide block 1 is lifted and lowered to perform the second bonding process II.