MANUFACTURE OF SEMICONDUCTOR DEVICE

MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To make a filling material having the minimum film thickness in consideration of the width size of a groove completely imbedded in the inside of the groove without increasing the film thickness of the filling material. CONSTITUTION:At the time of forming a groove 3 in a cross state, a swolle...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HORIKAWA YOSHIHIKO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To make a filling material having the minimum film thickness in consideration of the width size of a groove completely imbedded in the inside of the groove without increasing the film thickness of the filling material. CONSTITUTION:At the time of forming a groove 3 in a cross state, a swollen part Y is formed on the groove wall of the outer angle part X so that the size from the inner angle part Z to the outer angle part X, that is, the distance t5 between the inner angle part Z and the swollen part Y may not exceed the width size t1 of the groove 3.