PRINTED-WIRING BOARD REMODELLING PROCESSING SYSTEM

PURPOSE:To provide a printed-wiring board remodelling/processing system capable of avoiding the pattern cutting under an SMD pad to set part for fitting the surface concerning the automatic remodelling processing system of the printed-wiring board to surface mount the parts. CONSTITUTION:In a proces...

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1. Verfasser: KAWAMICHI TAKETSUGU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide a printed-wiring board remodelling/processing system capable of avoiding the pattern cutting under an SMD pad to set part for fitting the surface concerning the automatic remodelling processing system of the printed-wiring board to surface mount the parts. CONSTITUTION:In a processor to instruct the cut position of a wiring pattern connected to the pad to set the parts for surface mounting on a printed-wiring board, a first information input step 1 is provided, the information of the shape and position of the pad and the information of a pattern cutting prohibiting area are inputted, a second information input step 2 is provided, the information of the wiring pattern of the cutting object and the information of a net are inputted, a first deciding step 3 is provided, the cut position at the wiring pattern of the object is decided by each input information, a second deciding step 4 is provided, when the cut position is in the pattern cutting prohibiting area, the wiring pattern, which is on the same net and not in the area, is searched and the cut position is decided concerning the wiring pattern.