PRINTED WIRING BOARD

PURPOSE:To provide a printed wiring board, which can evaluate the wettability of the land of the printed wiring board during chip parts mounting and soldering, in the printed wiring board used in electronic apparatus. CONSTITUTION:A land for solder wettability evaluation is provided, which is electr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KASHIMURA NOBUO, MAEZAWA SATOSHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To provide a printed wiring board, which can evaluate the wettability of the land of the printed wiring board during chip parts mounting and soldering, in the printed wiring board used in electronic apparatus. CONSTITUTION:A land for solder wettability evaluation is provided, which is electrically separated from a land for chip parts mounting, and cream solder 2 is applied on that land 1 for solder wettability evaluation. The pattern of the cream solder 2 consists of at least two linear parts, and is made in the shape of being coupled at least one point. The area of the section where this cream solder 2 is applied and the area of the solder which has fused and get wet and spread at reflow are measured and compared, thus the wettability of the surface of a printed wiring board is evaluated in each process of reflow and besides evaluated at the same time at the mounting and soldering of chip parts.