CHIP-TYPE SOLID STATE ELECTROLYTIC CAPACITOR
PURPOSE:To make an anode lead plant surface a plane which is completely free from a projection by providing a metallic body for connecting an anode lead and a terminal inside an insulating resin layer and by cutting it off at an anode lead base. CONSTITUTION:Paste is applied to a palladium attached...
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creator | TANIGUCHI HIROMICHI |
description | PURPOSE:To make an anode lead plant surface a plane which is completely free from a projection by providing a metallic body for connecting an anode lead and a terminal inside an insulating resin layer and by cutting it off at an anode lead base. CONSTITUTION:Paste is applied to a palladium attached part only on an anode plant surface of a first metallic body 7a which consists of a plating layer, and a second insulating layer 8a is formed by heat hardening. Then, a conductor layer 9 is formed on an opposite surface of the anode lead plant surface and a peripheral part thereof. A second plating layer 10, a second metallic body 11a consisting of a plating layer and a solder layer 12 are formed one by one. Lastly, the anode lead is cut off to constitute a chip-type solid-state electrolytic capacitor. |
format | Patent |
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CONSTITUTION:Paste is applied to a palladium attached part only on an anode plant surface of a first metallic body 7a which consists of a plating layer, and a second insulating layer 8a is formed by heat hardening. Then, a conductor layer 9 is formed on an opposite surface of the anode lead plant surface and a peripheral part thereof. A second plating layer 10, a second metallic body 11a consisting of a plating layer and a solder layer 12 are formed one by one. Lastly, the anode lead is cut off to constitute a chip-type solid-state electrolytic capacitor.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRICITY</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920921&DB=EPODOC&CC=JP&NR=H04264709A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920921&DB=EPODOC&CC=JP&NR=H04264709A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANIGUCHI HIROMICHI</creatorcontrib><title>CHIP-TYPE SOLID STATE ELECTROLYTIC CAPACITOR</title><description>PURPOSE:To make an anode lead plant surface a plane which is completely free from a projection by providing a metallic body for connecting an anode lead and a terminal inside an insulating resin layer and by cutting it off at an anode lead base. CONSTITUTION:Paste is applied to a palladium attached part only on an anode plant surface of a first metallic body 7a which consists of a plating layer, and a second insulating layer 8a is formed by heat hardening. Then, a conductor layer 9 is formed on an opposite surface of the anode lead plant surface and a peripheral part thereof. A second plating layer 10, a second metallic body 11a consisting of a plating layer and a solder layer 12 are formed one by one. Lastly, the anode lead is cut off to constitute a chip-type solid-state electrolytic capacitor.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBx9vAM0A2JDHBVCPb38XRRCA5xDHFVcPVxdQ4J8veJDPF0VnB2DHB09gzxD-JhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GJkZmJuYGlo7GxKgBAKrbJY0</recordid><startdate>19920921</startdate><enddate>19920921</enddate><creator>TANIGUCHI HIROMICHI</creator><scope>EVB</scope></search><sort><creationdate>19920921</creationdate><title>CHIP-TYPE SOLID STATE ELECTROLYTIC CAPACITOR</title><author>TANIGUCHI HIROMICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04264709A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>TANIGUCHI HIROMICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANIGUCHI HIROMICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHIP-TYPE SOLID STATE ELECTROLYTIC CAPACITOR</title><date>1992-09-21</date><risdate>1992</risdate><abstract>PURPOSE:To make an anode lead plant surface a plane which is completely free from a projection by providing a metallic body for connecting an anode lead and a terminal inside an insulating resin layer and by cutting it off at an anode lead base. CONSTITUTION:Paste is applied to a palladium attached part only on an anode plant surface of a first metallic body 7a which consists of a plating layer, and a second insulating layer 8a is formed by heat hardening. Then, a conductor layer 9 is formed on an opposite surface of the anode lead plant surface and a peripheral part thereof. A second plating layer 10, a second metallic body 11a consisting of a plating layer and a solder layer 12 are formed one by one. Lastly, the anode lead is cut off to constitute a chip-type solid-state electrolytic capacitor.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY |
title | CHIP-TYPE SOLID STATE ELECTROLYTIC CAPACITOR |
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