CHIP-TYPE SOLID STATE ELECTROLYTIC CAPACITOR

PURPOSE:To make an anode lead plant surface a plane which is completely free from a projection by providing a metallic body for connecting an anode lead and a terminal inside an insulating resin layer and by cutting it off at an anode lead base. CONSTITUTION:Paste is applied to a palladium attached...

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Bibliographische Detailangaben
1. Verfasser:	TANIGUCHI HIROMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
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Beschreibung
Zusammenfassung:	PURPOSE:To make an anode lead plant surface a plane which is completely free from a projection by providing a metallic body for connecting an anode lead and a terminal inside an insulating resin layer and by cutting it off at an anode lead base. CONSTITUTION:Paste is applied to a palladium attached part only on an anode plant surface of a first metallic body 7a which consists of a plating layer, and a second insulating layer 8a is formed by heat hardening. Then, a conductor layer 9 is formed on an opposite surface of the anode lead plant surface and a peripheral part thereof. A second plating layer 10, a second metallic body 11a consisting of a plating layer and a solder layer 12 are formed one by one. Lastly, the anode lead is cut off to constitute a chip-type solid-state electrolytic capacitor.