EPOXY RESIN MOLDING MATERIAL FOR SEALING
PURPOSE:To obtain an epoxy resin molding material for sealing an electric or electronic part and a semiconductor element which is excellent in moldability, moisture resistance after soldering and markability. CONSTITUTION:An epoxy resin molding material for sealing which comprises a dihydroxydipheny...
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| creator | KAGAWA HIROHIKO MIYATANI YOSHIHIRO |
| description | PURPOSE:To obtain an epoxy resin molding material for sealing an electric or electronic part and a semiconductor element which is excellent in moldability, moisture resistance after soldering and markability. CONSTITUTION:An epoxy resin molding material for sealing which comprises a dihydroxydiphenylmethane derivative. |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | EPOXY RESIN MOLDING MATERIAL FOR SEALING |
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