EPOXY RESIN MOLDING MATERIAL FOR SEALING

PURPOSE:To obtain an epoxy resin molding material for sealing an electric or electronic part and a semiconductor element which is excellent in moldability, moisture resistance after soldering and markability. CONSTITUTION:An epoxy resin molding material for sealing which comprises a dihydroxydipheny...

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Bibliographische Detailangaben
Hauptverfasser:	KAGAWA HIROHIKO, MIYATANI YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain an epoxy resin molding material for sealing an electric or electronic part and a semiconductor element which is excellent in moldability, moisture resistance after soldering and markability. CONSTITUTION:An epoxy resin molding material for sealing which comprises a dihydroxydiphenylmethane derivative.