FINE PARTICLE FOR SOLDERING, CREAM SOLDER FORMED BY USING THIS FINE PARTICLE AND PRODUCTION OF THIS CREAM SOLDER

PURPOSE:To produce the cream solder which prevents the oxidation of solder particles and obviates the generation of solder balls by coating the entire surface of the fine particles of a fusible alloy with an org. flux, then adding a binder and solvent thereto and kneading the mixture. CONSTITUTION:M...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA YUKIO, UMIBE SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE:To produce the cream solder which prevents the oxidation of solder particles and obviates the generation of solder balls by coating the entire surface of the fine particles of a fusible alloy with an org. flux, then adding a binder and solvent thereto and kneading the mixture. CONSTITUTION:Metals consisting of tin and lead are so compounded as to form an eutectic alloy and are melted by heating. The molten alloy is pulverized by an atomizer method, etc., to obtain the solder particles 11 consisting of the fine particles of the fusible alloy. The solder particles 11 are immersed into the solvent of the org. flux. The particles are then taken out of the soln. and are dried, by which the particles are coated with the flux 12. The binder and the solvent 13 are thereafter added to the flux-coated solder particles 11 and the particles are kneaded. The oxidation of the surfaces of the solder particles 11 is prevented in this way and the generation of the solder balls at the time of reflow is prevented. The cream solder which has a long life and good solder wettability is thus obtd.