MANUFACTURE OF PRINTED CIRCUIT BOARD

PURPOSE:To apply without generating a pinhole and with high adhesion a photoresist to the surface of a metal layer by using a cation type electrodeposition photoresist. CONSTITUTION:In the case of coating the surface of a metal layer of a circuit board by electrodepositing a cation type electrodepos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NOBETANI TORU, FUKUSHIMA MUNEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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