MANUFACTURE OF PRINTED CIRCUIT BOARD

PURPOSE:To apply without generating a pinhole and with high adhesion a photoresist to the surface of a metal layer by using a cation type electrodeposition photoresist. CONSTITUTION:In the case of coating the surface of a metal layer of a circuit board by electrodepositing a cation type electrodepos...

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Bibliographische Detailangaben
Hauptverfasser:	NOBETANI TORU, FUKUSHIMA MUNEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To apply without generating a pinhole and with high adhesion a photoresist to the surface of a metal layer by using a cation type electrodeposition photoresist. CONSTITUTION:In the case of coating the surface of a metal layer of a circuit board by electrodepositing a cation type electrodeposition photoresist, as a pretreatment of the coating, the surface of the layer of the board is degreased with acid series degreasing agent, and soft-etched with acid series etchant. There is not fear that adhesive properties of the layer with the photoresist are decreased due to mixture of alkali with cation type electrodeposition photoresist liquid or a pinhole is generated.