PRODUCTION OF SOLDER PARTICLE

PURPOSE:To enable production of spherical solder particles having uniform sphericity and particle size by forming solder on the surface of spherical copper particles having a uniform particle size by substitution plating method. CONSTITUTION:Copper particles 2 of about 30-50mum particle diameter are...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA YUKIO, UMIBE SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To enable production of spherical solder particles having uniform sphericity and particle size by forming solder on the surface of spherical copper particles having a uniform particle size by substitution plating method. CONSTITUTION:Copper particles 2 of about 30-50mum particle diameter are first dipped in an etching liquid, washed with water and dried. Then, these particles are dipped in an active treatment agent, washed with water, and dipped in an electroless substitution plating liquid at about 50 deg.C for ten minutes, washed with water and dried. Thereby, a solder layer 3 of about 1-2mum thickness is formed on the surface of the copper particle 2.