SOLDER COATING METHOD

PURPOSE:To form a solder layer having a uniform thickness by forming a solder layer by a substitution plating method on the copper pattern surface of a copper lined laminate. CONSTITUTION:Copper foil 2 is laminated on a substrate 1 consisting of a glass epoxy resin, etc., to form the copper lined la...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA YUKIO, UMIBE SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To form a solder layer having a uniform thickness by forming a solder layer by a substitution plating method on the copper pattern surface of a copper lined laminate. CONSTITUTION:Copper foil 2 is laminated on a substrate 1 consisting of a glass epoxy resin, etc., to form the copper lined laminate. The solder layer 11 is formed by the substitution plating method on the surface of the copper patterns of the copper lined laminate. The solder layer is uniformly formed in a short period of time with simple equipment in this way.