MANUFACTURE OF PRINTED BOARD

PURPOSE:To acquire a printed board of highly reliable through hole connection without residue of set resist by filling the through hole with filling ink before applying ultraviolet(UV) curing solder resist. CONSTITUTION:A hole is formed in a copper clad laminated board which is provided with copper...

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Bibliographische Detailangaben
1. Verfasser:	CHINO TAKAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To acquire a printed board of highly reliable through hole connection without residue of set resist by filling the through hole with filling ink before applying ultraviolet(UV) curing solder resist. CONSTITUTION:A hole is formed in a copper clad laminated board which is provided with copper foil 2 on a board 1, a catalyst layer 3 for chemical copper plating is formed in the hole and a through hole is filled with filling ink 4 to form an etching resist pattern 5. Copper foil in an exposed part is removed by etching. After the etching resist pattern 5 is peeled off and a land 6 of a desired circuit shape is formed, a UV curing solder resist 7 is applied all over and set by heat. Thereby, a printed circuit board of high density and high performance can be manufactured.