SOLID-STATE IMAGE SENSOR MODULE
PURPOSE:To enhance hermetical sealability without increasing in size by increasing the area of an optical member in contact with sealing resin larger than that of a sectional surface perpendicular to the light receiving surface of the member. CONSTITUTION:The area of an optical member 16 in contact...
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| creator | MURANAKA YUICHI |
| description | PURPOSE:To enhance hermetical sealability without increasing in size by increasing the area of an optical member in contact with sealing resin larger than that of a sectional surface perpendicular to the light receiving surface of the member. CONSTITUTION:The area of an optical member 16 in contact with sealing resin 7 is increased larger than that of a sectional surface perpendicular to the light receiving surface of the member 16. Since the end face of an optical glass 6 is formed to be rough, the contact area of the glass 6 with the resin 7 is increased larger than the contact area in the case in which the end face of the glass 6 is smooth, i.e., the area of a sectional surface perpendicular to the light receiving surface of the glass 6 to improve its adhesive strength without increasing in thickness of the glass 6 and to also increase a sealing pass of a CCD 4 with the atmosphere. Thus, the hermetical sealability of a solid state image sensor can be enhanced by using a relatively thin optical member. |
| format | Patent |
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CONSTITUTION:The area of an optical member 16 in contact with sealing resin 7 is increased larger than that of a sectional surface perpendicular to the light receiving surface of the member 16. Since the end face of an optical glass 6 is formed to be rough, the contact area of the glass 6 with the resin 7 is increased larger than the contact area in the case in which the end face of the glass 6 is smooth, i.e., the area of a sectional surface perpendicular to the light receiving surface of the glass 6 to improve its adhesive strength without increasing in thickness of the glass 6 and to also increase a sealing pass of a CCD 4 with the atmosphere. 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CONSTITUTION:The area of an optical member 16 in contact with sealing resin 7 is increased larger than that of a sectional surface perpendicular to the light receiving surface of the member 16. Since the end face of an optical glass 6 is formed to be rough, the contact area of the glass 6 with the resin 7 is increased larger than the contact area in the case in which the end face of the glass 6 is smooth, i.e., the area of a sectional surface perpendicular to the light receiving surface of the glass 6 to improve its adhesive strength without increasing in thickness of the glass 6 and to also increase a sealing pass of a CCD 4 with the atmosphere. Thus, the hermetical sealability of a solid state image sensor can be enhanced by using a relatively thin optical member.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DIAGNOSIS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>IDENTIFICATION</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURGERY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAP9vfxdNENDnEMcVXw9HV0d1UIdvUL9g9S8PV3CfVx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BHgYmRsYmZpaOxkQoAQCWJSFq</recordid><startdate>19920127</startdate><enddate>19920127</enddate><creator>MURANAKA YUICHI</creator><scope>EVB</scope></search><sort><creationdate>19920127</creationdate><title>SOLID-STATE IMAGE SENSOR MODULE</title><author>MURANAKA YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0423469A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DIAGNOSIS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>IDENTIFICATION</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURGERY</topic><toplevel>online_resources</toplevel><creatorcontrib>MURANAKA YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MURANAKA YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLID-STATE IMAGE SENSOR MODULE</title><date>1992-01-27</date><risdate>1992</risdate><abstract>PURPOSE:To enhance hermetical sealability without increasing in size by increasing the area of an optical member in contact with sealing resin larger than that of a sectional surface perpendicular to the light receiving surface of the member. CONSTITUTION:The area of an optical member 16 in contact with sealing resin 7 is increased larger than that of a sectional surface perpendicular to the light receiving surface of the member 16. Since the end face of an optical glass 6 is formed to be rough, the contact area of the glass 6 with the resin 7 is increased larger than the contact area in the case in which the end face of the glass 6 is smooth, i.e., the area of a sectional surface perpendicular to the light receiving surface of the glass 6 to improve its adhesive strength without increasing in thickness of the glass 6 and to also increase a sealing pass of a CCD 4 with the atmosphere. Thus, the hermetical sealability of a solid state image sensor can be enhanced by using a relatively thin optical member.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS DIAGNOSIS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION MEDICAL OR VETERINARY SCIENCE PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES SURGERY |
| title | SOLID-STATE IMAGE SENSOR MODULE |
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