SOLID-STATE IMAGE SENSOR MODULE

PURPOSE:To enhance hermetical sealability without increasing in size by increasing the area of an optical member in contact with sealing resin larger than that of a sectional surface perpendicular to the light receiving surface of the member. CONSTITUTION:The area of an optical member 16 in contact with sealing resin 7 is increased larger than that of a sectional surface perpendicular to the light receiving surface of the member 16. Since the end face of an optical glass 6 is formed to be rough, the contact area of the glass 6 with the resin 7 is increased larger than the contact area in the case in which the end face of the glass 6 is smooth, i.e., the area of a sectional surface perpendicular to the light receiving surface of the glass 6 to improve its adhesive strength without increasing in thickness of the glass 6 and to also increase a sealing pass of a CCD 4 with the atmosphere. Thus, the hermetical sealability of a solid state image sensor can be enhanced by using a relatively thin optical member.