SYSTEM FOR AUTOMATIC BONDING OF ELECTRONIC COMPONENT TO CIRCUIT BOARD

PURPOSE: To provide a method for efficiently and accurately assembling an electronic system, by utilizing a robotics technology. CONSTITUTION: This invention is characterized in the application to the automatic bonding of electronic components to a circuit board 30. A layout/bonding heat 28 is mounted on an operable robot arm 20, and utilized to select electronic components having leads from electronic components feed sources and to position the components adjacent to contact pads on the circuit board. The components are held in the layout/bonding head and bonded thermally to the contact pads. Thus, without multiplying operation of the electronic components, they are gripped, tested, accurately positioned at desired regions on the circuit board and bonded thereto. The dispersion of thermal loads exerted on blades, which would cause the bonding error, is effectively eliminated.