SEMICONDUCTOR DEVICE

PURPOSE:To make easy a fixing workability in a semiconductor device by a method wherein a metallic bump is respectively provided on the semiconductor chip side and the substrate lead side, both metallic bumps are connected by a heat-compressing or by a melt-compressing in a condition that only one b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIGYO HIROYUKI, ITABASHI KAZUMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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