SEMICONDUCTOR DEVICE

PURPOSE:To make easy a fixing workability in a semiconductor device by a method wherein a metallic bump is respectively provided on the semiconductor chip side and the substrate lead side, both metallic bumps are connected by a heat-compressing or by a melt-compressing in a condition that only one b...

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Bibliographische Detailangaben
Hauptverfasser:	SHIGYO HIROYUKI, ITABASHI KAZUMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To make easy a fixing workability in a semiconductor device by a method wherein a metallic bump is respectively provided on the semiconductor chip side and the substrate lead side, both metallic bumps are connected by a heat-compressing or by a melt-compressing in a condition that only one bump is melted, and also both the metallic bumps differ in sort and shape. CONSTITUTION:Metallic bumps 5, 6 are respectively formed on a wire 2 of a chip 1 and a lead 4 of a substrate 3, both bumps are connected by a thermo- compression bonding method or a fusion bonding method in a condition that only one metallic bump is melted. The metallic bumps 5, 6 are made of different materials selected from Au, Pd, Pt, Ni, Cu, or their alloys, Pb-Sn, Pb-In, Sn-In or the like, and differ in size and shape.