SEMICONDUCTOR DEVICE

PURPOSE:To prevent soldering material from leaking toward a suspension lead by a method wherein a U-shaped soldering material blocking recess is provided in a suspension lead which supports an island, and a wire is connected inside the recess. CONSTITUTION:A soldering material block 9 is half-etched...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: FUJIE AKIRA
Format: Patent
Sprache:eng
Schlagworte:
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