SEMICONDUCTOR DEVICE

PURPOSE:To prevent soldering material from leaking toward a suspension lead by a method wherein a U-shaped soldering material blocking recess is provided in a suspension lead which supports an island, and a wire is connected inside the recess. CONSTITUTION:A soldering material block 9 is half-etched into a U shape, and a soldering material 7 is prevented from flowing inside the half-etched part, and a wire 5 is connected to a protrusion 10 inside the half-etched part. That is, soldering material is prevented from flowing into the U-shaped part. Therefore, a wire can be easily connected to a suspension lead, in result a semiconductor device of this design can be improved in workability.