TAPE CARRIER FOR TAB
PURPOSE:To facilitate etching of a leading-around wiring, by forming a metal foil in the manner in which one part of the foil is thinner than the other part. CONSTITUTION:After a metal foil is stuck on an insulating film having punching holes such as device holes and outer holes, resist is spread on...
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| creator | CHIBA TSUKASA |
| description | PURPOSE:To facilitate etching of a leading-around wiring, by forming a metal foil in the manner in which one part of the foil is thinner than the other part. CONSTITUTION:After a metal foil is stuck on an insulating film having punching holes such as device holes and outer holes, resist is spread on an outer lead pattern part 1 and an inner lead pattern part 3 by screen printing and the like. The metal foil surface of a leading-around wiring 2 is eliminated with etching solution, and one part of the metal foil is made thinner than the other part. After the resist is eliminated from tape material wherein a part of the copper foil surface is thinned by etching, a wiring pattern is formed by an ordinary photoetching method. Thereby the design freedom of the leading-around wiring is improved in the case of a tape carrier of fine pattern, and the number of lead pins can be increased. |
| format | Patent |
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CONSTITUTION:After a metal foil is stuck on an insulating film having punching holes such as device holes and outer holes, resist is spread on an outer lead pattern part 1 and an inner lead pattern part 3 by screen printing and the like. The metal foil surface of a leading-around wiring 2 is eliminated with etching solution, and one part of the metal foil is made thinner than the other part. After the resist is eliminated from tape material wherein a part of the copper foil surface is thinned by etching, a wiring pattern is formed by an ordinary photoetching method. Thereby the design freedom of the leading-around wiring is improved in the case of a tape carrier of fine pattern, and the number of lead pins can be increased.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920127&DB=EPODOC&CC=JP&NR=H0422146A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920127&DB=EPODOC&CC=JP&NR=H0422146A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIBA TSUKASA</creatorcontrib><title>TAPE CARRIER FOR TAB</title><description>PURPOSE:To facilitate etching of a leading-around wiring, by forming a metal foil in the manner in which one part of the foil is thinner than the other part. CONSTITUTION:After a metal foil is stuck on an insulating film having punching holes such as device holes and outer holes, resist is spread on an outer lead pattern part 1 and an inner lead pattern part 3 by screen printing and the like. The metal foil surface of a leading-around wiring 2 is eliminated with etching solution, and one part of the metal foil is made thinner than the other part. After the resist is eliminated from tape material wherein a part of the copper foil surface is thinned by etching, a wiring pattern is formed by an ordinary photoetching method. Thereby the design freedom of the leading-around wiring is improved in the case of a tape carrier of fine pattern, and the number of lead pins can be increased.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJcQxwVXB2DArydA1ScPMPUghxdOJhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GJkZGhiZmjsZEKAEAJ7UeEQ</recordid><startdate>19920127</startdate><enddate>19920127</enddate><creator>CHIBA TSUKASA</creator><scope>EVB</scope></search><sort><creationdate>19920127</creationdate><title>TAPE CARRIER FOR TAB</title><author>CHIBA TSUKASA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0422146A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIBA TSUKASA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIBA TSUKASA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TAPE CARRIER FOR TAB</title><date>1992-01-27</date><risdate>1992</risdate><abstract>PURPOSE:To facilitate etching of a leading-around wiring, by forming a metal foil in the manner in which one part of the foil is thinner than the other part. CONSTITUTION:After a metal foil is stuck on an insulating film having punching holes such as device holes and outer holes, resist is spread on an outer lead pattern part 1 and an inner lead pattern part 3 by screen printing and the like. The metal foil surface of a leading-around wiring 2 is eliminated with etching solution, and one part of the metal foil is made thinner than the other part. After the resist is eliminated from tape material wherein a part of the copper foil surface is thinned by etching, a wiring pattern is formed by an ordinary photoetching method. Thereby the design freedom of the leading-around wiring is improved in the case of a tape carrier of fine pattern, and the number of lead pins can be increased.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | TAPE CARRIER FOR TAB |
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