TAPE CARRIER FOR TAB

PURPOSE:To facilitate etching of a leading-around wiring, by forming a metal foil in the manner in which one part of the foil is thinner than the other part. CONSTITUTION:After a metal foil is stuck on an insulating film having punching holes such as device holes and outer holes, resist is spread on...

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Bibliographische Detailangaben
1. Verfasser: CHIBA TSUKASA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To facilitate etching of a leading-around wiring, by forming a metal foil in the manner in which one part of the foil is thinner than the other part. CONSTITUTION:After a metal foil is stuck on an insulating film having punching holes such as device holes and outer holes, resist is spread on an outer lead pattern part 1 and an inner lead pattern part 3 by screen printing and the like. The metal foil surface of a leading-around wiring 2 is eliminated with etching solution, and one part of the metal foil is made thinner than the other part. After the resist is eliminated from tape material wherein a part of the copper foil surface is thinned by etching, a wiring pattern is formed by an ordinary photoetching method. Thereby the design freedom of the leading-around wiring is improved in the case of a tape carrier of fine pattern, and the number of lead pins can be increased.