SEMICONDUCTOR MANUFACTURING EQUIPMENT

PURPOSE:To simplify or eliminate manhour for adjusting parallelism, by retaining a stage on an elastic body, which stage faces a bonding tool and mounts a semiconductor element. CONSTITUTION:A semiconductor element 6 is put on a stage 1, and a tape 9 is so arranged that a protruding electrode 7 and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAGOURA HIDEYA, SHIBATA JUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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