SEMICONDUCTOR MANUFACTURING EQUIPMENT

PURPOSE:To simplify or eliminate manhour for adjusting parallelism, by retaining a stage on an elastic body, which stage faces a bonding tool and mounts a semiconductor element. CONSTITUTION:A semiconductor element 6 is put on a stage 1, and a tape 9 is so arranged that a protruding electrode 7 and...

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Bibliographische Detailangaben
Hauptverfasser:	YAGOURA HIDEYA, SHIBATA JUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To simplify or eliminate manhour for adjusting parallelism, by retaining a stage on an elastic body, which stage faces a bonding tool and mounts a semiconductor element. CONSTITUTION:A semiconductor element 6 is put on a stage 1, and a tape 9 is so arranged that a protruding electrode 7 and a lead 8 coincide with each other. A bonding tool 7 is pressed down. The protruding electrode 7 and the lead 8 are heated, pressed, and electrically and mechanically connected with each other. Even if the parallelism concerning the surface of the bonding tool 2 and that of the stage 1 is not perfect when the bonding tool 2 is pressed down, and the protruding electrode 7 and the lead 8 are heated, pressed and compression-bonded, the parallelism is automatically obtained and superior compression-bonding can be realized, because a liquid encapsulating pad 10 and springs 11 are deformed.