MANUFACTURE OF CONTACT PIN
PURPOSE:To reduce the quantity of Au plating and reduce the cost of a contact pin by applying Au plating only to the necessary portion of a wire forming the contact pin. CONSTITUTION:A contact pin 24 is pressed to the tip section of a lead wire 26 by a splice 27 to form a contact pin 23, a film is r...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To reduce the quantity of Au plating and reduce the cost of a contact pin by applying Au plating only to the necessary portion of a wire forming the contact pin. CONSTITUTION:A contact pin 24 is pressed to the tip section of a lead wire 26 by a splice 27 to form a contact pin 23, a film is removed from the tip section of the lead wire 26 to form an exposure section, and it is pressed to the end section of the contact pin 24. Au plating 29 is applied to the outer periphery of the middle section of the contact pin 24 to obtain good conduction between the terminal 25 of a plug 22 and the lead wire 26. The Au plating 29 is applied only to the necessary portion of a wire 33 forming the contact pin 24 in advance, and the wire 33 and the lead wire 26 are cut by the splice 27. The quantity of the Au plating 29 is made very small, and no temporary fixing of the contact pin 24 is required. |
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