EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

PURPOSE:To obtain a resin composition having excellent moisture resistance and useful for the sealing of a large scale integrated circuit by compounding an epoxy resin, a brominated epoxy resin, a novolak-type phenolic resin, a cure accelerator, an antimony compound and a halogen ion exchanging mate...

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Bibliographische Detailangaben
1. Verfasser:	FUJIEDA YOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a resin composition having excellent moisture resistance and useful for the sealing of a large scale integrated circuit by compounding an epoxy resin, a brominated epoxy resin, a novolak-type phenolic resin, a cure accelerator, an antimony compound and a halogen ion exchanging material under specific condition. CONSTITUTION:The objective composition is produced by using (A) an epoxy resin (e.g. bisphenol A epoxy resin), (B) a brominated epoxy resin (e.g. bisphenol- type brominated epoxy resin), (C) a novolak-type phenolic resin, (D) a cure accelerator (e.g. BDMA or triphenylphosphine), (E) an antimony compound (e.g. antimony trioxide) and (F) a halogen ion exchanging material (e.g. hydrotalcite) as main components, mixing the components A, B and F or the components A, B, F and E in molten state and compounding the mixture to the other components.