MODIFICATION OF CONDUCTIVITY OF RESIN MOLDING

PURPOSE:To obtain a resin molding of improved electric conductivity without detriment to its properties and without causing its discoloration by molding a mixture obtained by kneading a resin molding material with a specified complex. CONSTITUTION:An organic polymeric compound (i) obtained by crossl...

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Bibliographische Detailangaben
Hauptverfasser: MORI SHIGEO, MOTOGAMI KENJI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To obtain a resin molding of improved electric conductivity without detriment to its properties and without causing its discoloration by molding a mixture obtained by kneading a resin molding material with a specified complex. CONSTITUTION:An organic polymeric compound (i) obtained by crosslinking an organic compound having a skeleton of formula I {wherein Z is a residue of an active hydrogen compound; Y is an active hydrogen group; k is 1-12; E is a copolymer of unit of formula II [wherein n is 0-25; R is 1-20 C alkyl or aryl] with unit B comprising an alkylene oxide} is mixed with 0.5-10wt.%, based on component (i), component (i)-soluble electrolyte salt (ii) dissolved in a solvent highly compatible with the organic compound, and the solvent is removed from the mixture to obtain a complex (b). A resin molding material (a) is kneaded with 1-30wt.%, based on component (a), component (b) to obtain a mixture. This mixture is molded to obtain a resin molding.