SEMICONDUCTOR DEVICE

PURPOSE:To simplify alignment of a semiconductor element with a substrate and improve productivity by making a bump electrode, a protrusion or an element recess of the semiconductor element engaged with a substrate recess or a bump electrode on the substrate. CONSTITUTION:A substrate 2a has a substrate recess 6 corresponding to a bump electrode 5 provided on a semiconductor element 1a, while a conductive layer 4 is formed in the substrate recess 6. A semiconductor device is formed by combining a semiconductor element 10 having the bump electrode 5, a protrusion or an element recess 7 and a substrate 2a having the substrate recess 6 or the bump electrode 5 corresponding to the above bump electrode 5, the protrusion 9 or the element recess 7. That is, the bump electrode 5, the protrusion 9 or the element recess 7 on the semiconductor element 1a are engaged with the corresponding substrate recess 6 or the bump electrode 5 on the substrate 20 each other. Thus correct alignment can be easily performed.