DRY ETCHING EQUIPMENT

PURPOSE:To obtain a dry etching equipment capable of preventing corrosion, by installing a mechanism for carrying semiconductor substrates between an etching chamber and a heat-treating chamber in a vacuum atmosphere. CONSTITUTION:In the title equipment, an unload lock chamber 104 can accommodate one carrier amount of semiconductor substrates. One carrier amount of the semiconductor substrates which have been etched in an etching chamber 103 are accommodated en bloc in the unload lock chamber 104, heat-treated in a heat-treating chamber 105, and carried in a vacuum atmosphere between the etching chamber 103 and the heat-treating chamber 105 by conveying mechanisms 108, 109, 110. Since the unloack lock chamber 104 can accommodate one carrier amount of the semiconductor, the time margion for processing one carrier amount of the semiconductor substrates can be obtained, and heat treatment can be done for a time necessary and sufficient to prevent corrosion.