PHOTOSENSITIVE RESIN COMPOSITION

PURPOSE:To provide a photosensitive resin composition by means of which excellent molding of a matrix is effected by consisting mainly of components A, B, C, and D of a specified composition. CONSTITUTION:A composition of four components consists of A) 100wt.pts. completely saponified or partially saponified polyacetate vinyl having a saponification degree of 50 - 100mol%, B) 1 - 100wt.pts. polyvinylpirrolidone having a polymerization degree of 50 - 5,000, C) 0.1 - 40wt.pts. fourth grade ammonium salt having a molecular weight of 2,000 or less, and D) 10 - 140wt.pts. an ethylene unsaturated monomer. A method of manufacture of this composition is such that a mixture of completely saponified or partially saponified polyacetate vinyl of the component A and polyvinyl pyrrolidone of the component B is heated and dissolved in water and alcohol. Thereafter, fourth grade ammonium salt of the component C, and the ethylene unsaturated monomer of the component D and a photopolymerization initiator, a thermal polymerization inhibitor, and a dyestuff are added and agitated for enough mixture.