METHOD OF MANUFACTURING SOFT BASE MATERIAL, SAID SOFT BASE MATERIAL AND ELECTRONIC CIRCUIT AND PART HAVING SAID SOFT BASE MATERIAL

PURPOSE: To manufacture, easily and at a low cost, a board having thermal load resistivity, shape stability and adhesivity by coating a copper foil with a solution consisting of polyamide carboxylic acid or polyimide, a filler and organic solvents as its major components. CONSTITUTION: A primer cons...

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Bibliographische Detailangaben
Hauptverfasser:	HANSUUYOAHIMU HERAA, RAINAA BURUUMU, KAARUHAINTSU BURUSUTO, BUERUNAA HERUTSUOOKU, KURAUSUUBUIRUHERUMU RIINERUTO
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: To manufacture, easily and at a low cost, a board having thermal load resistivity, shape stability and adhesivity by coating a copper foil with a solution consisting of polyamide carboxylic acid or polyimide, a filler and organic solvents as its major components. CONSTITUTION: A primer consisting of one or more varieties of polyamide carboxylic acid or polyimides of 5 to 35 wt.% based on total weight, a filler of 1 to 75 wt.% based on the weight of polyamide carboxylic acid, etc., and one or more varieties of organic solvents as its major components is applied so as to obtain a dry film thickness of 4 to 90 μm, is heated at a temperature of 70 to 125 deg.C for 1 to 30 minutes and is dried, Then, a top coat having one or more varieties of polyamide carboxylic acid or polyimide of 5 to 35 wt.% based on total weight and one or more varieties of organic solvents as its major components is coated so as to obtain a dry film thickness of 2 to 70 μm and is dried in the same manner. Finally, the primer and the top coat are heated together at a temperature of 200 to 350 deg.C for 1 to 30 minutes to be baked.