METHOD OF LAYING THIN WIRE

PURPOSE:To inexpensively lay a thin wire and, at the same time, to easily handle a printed board by fixing part of the thin wire cut to a fixed length to the printed board and laying around the thin wire from the fixed point by bending the wire in a plane parallel to the surface of the printed board...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATAHIRA HIROSHI, SASADA MASATO, UEDA SHOJI, OGAWARA TOSHIYUKI, KADOTA TAKAYUKI, TAKIMOTO HIROTAKA, SASAKI TAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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