METHOD OF LAYING THIN WIRE

PURPOSE:To inexpensively lay a thin wire and, at the same time, to easily handle a printed board by fixing part of the thin wire cut to a fixed length to the printed board and laying around the thin wire from the fixed point by bending the wire in a plane parallel to the surface of the printed board...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATAHIRA HIROSHI, SASADA MASATO, UEDA SHOJI, OGAWARA TOSHIYUKI, KADOTA TAKAYUKI, TAKIMOTO HIROTAKA, SASAKI TAISUKE
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To inexpensively lay a thin wire and, at the same time, to easily handle a printed board by fixing part of the thin wire cut to a fixed length to the printed board and laying around the thin wire from the fixed point by bending the wire in a plane parallel to the surface of the printed board. CONSTITUTION:After a thin wire 1 is cut to a fixed length with a pre-cutting device 14, the sheath 6 of the wire 1 is removed from the end section of the wire 1 and a slack forming section 9 is formed on the wire 1 by means of a slack forming device 22. After forming the section 9, the core 7 of the wire at the end section is formed to a semicircular shape. Then, by holding the wire 1 with a wire laying head 15, a starting point is fixed by tying one end core 7 of the wire 1 to a terminal 3 protruding from a prescribed land 8 and the other end of the wire 1 is fixed to a printed board 2 by applying a bonding agent with the head 15. After fixing the other end of the wire 1, the wire 1 is laid around on the surface of the board 2 starting from the point where the bonding agent 5 is applied, namely, the other end of the wire 1 is fixed by moving the head 15 and bending the wire 1 in a plane parallel to the surface of the board 2.