RESIN COMPOSITION FOR FORMING SURFACE LAYER OF RESIN MOLD

PURPOSE:To improve the heat resistance of a cast resin mold by compounding a liq. epoxy resin, a liq. alicyclic amine, an arom. amine, and a metal powder. CONSTITUTION:The title compsn. is obtained by compounding 20-40wt.% liq. epoxy resin having a viscosity at 25 deg.C of 4000cP or lower and at lea...

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Bibliographische Detailangaben
Hauptverfasser:	KATSUKAWA MAKOTO, ASANO TATSUO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To improve the heat resistance of a cast resin mold by compounding a liq. epoxy resin, a liq. alicyclic amine, an arom. amine, and a metal powder. CONSTITUTION:The title compsn. is obtained by compounding 20-40wt.% liq. epoxy resin having a viscosity at 25 deg.C of 4000cP or lower and at least two epoxy groups in the molecule (e.g. a bisphenol AD epoxy resin), 1-15wt.% liq. alicyclic amine (e.g. liq. diaminodicyclohexylmethane), 1-15wt.% arom. amine (e.g. an aniline-formaline condensate) in a wt. ratio of the alicyclic to the arom. amine of (2:8) to (9:1), 30-80wt.% metal powder (e.g. an electrolytic copper powder), and, according to needs, a thixotropic agent, a defoaming agent, an antisettling agent, a curing accelerator, etc.