UNSEALING METHOD OF IC PACKAGE

PURPOSE:To enable the title IC package to be unsealed without breaking down the other parts excluding the specific part by a method when a metallic member in different thermal expansion coefficient from that of a ceramic is bonded onto the cap of ceramic package and then the sealed part is broken down by giving thermal shocks. CONSTITUTION:A metallic sheet 6 in different thermal expansion coefficient is stuck on the cap 1 of a ceramic package using a bonding agent 5. Next, the thermal shock is given to the whole package within proper temperature range. Thus, a stress is imposed on the ceramic package due to the difference in the thermal expansion coefficient giving a crack in the most fragile glass sealed part. Furthermore, when the thermal shocks are repeatedly given, the cracked area is spread finally to separate the cap 1 from the ceramic main body 4. Through these procedures, a specimen of the IC package can be unsealed without impressing excessive stress thereon thereby avoiding the mixing of fragments in the IC package or the breakdown of a chip 8.