PPGA TYPE SEMICONDUCTOR DEVICE
PURPOSE:To intensify the adhering strength between a sealing resin and metallic cap by providing recessing and projecting sections at the sticking surface of the metallic cap. CONSTITUTION:After an Al plate having a thickness of about 0.3mm is fabricated by forming and a plated film having a thickne...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PURPOSE:To intensify the adhering strength between a sealing resin and metallic cap by providing recessing and projecting sections at the sticking surface of the metallic cap. CONSTITUTION:After an Al plate having a thickness of about 0.3mm is fabricated by forming and a plated film having a thickness of 10mum is formed on the surface of the Al plate, the central part on the internal surface of the Al plate is subject to sandblast. Because of the sandblast, the sticking area and adhesive strength between a metallic cap and sealing resin can be increased and the temperature change resistance of a PPGA type semiconductor device can be improved. |
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